Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400989 | Arrangement of power-grounds in package structures | Ting-Yu Yeh, Chun Hua Chang, Fong-Yuan Chang | 2025-08-26 |
| 12368148 | Info packages including thermal dissipation blocks | Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin | 2025-07-22 |
| 12299369 | Systems and methods of estimating thermal properties of semiconductor devices | Ching-Yi Lin, Fong-Yuan Chang, Po-Yu Chen, Po-Hsiang Huang, Chih-Wei Chang | 2025-05-13 |
| 12261095 | Semiconductor package having an encapulant comprising conductive fillers and method of manufacture | Xinyu BAO, Lee-Chung Lu, Fong-Yuan Chang, Sam Vaziri, Po-Hsiang Huang | 2025-03-25 |