Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261095 | Semiconductor package having an encapulant comprising conductive fillers and method of manufacture | Xinyu BAO, Lee-Chung Lu, Jyh Chwen Frank Lee, Fong-Yuan Chang, Po-Hsiang Huang | 2025-03-25 |