Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300574 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2025-05-13 |
| 12266633 | Semiconductor structure and method of forming the same | Pu Wang, Li-Hui Cheng, An-Jhih Su, Szu-Wei Lu | 2025-04-01 |
| 12218117 | Method of forming package structure and package structure therefrom | Chin-Fu Kao, Li-Hui Cheng, Szu-Wei Lu | 2025-02-04 |
| 12211818 | Manufacturing method of semiconductor package using jig | Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Szu-Wei Lu | 2025-01-28 |