Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362315 | Heterogeneous dielectric bonding scheme | Chen-Hua Yu, Wen-Chih Chiou, Ku-Feng Yang | 2025-07-15 |
| 12322680 | Semiconductor device having backside interconnect structure on through substrate via | Yung-Chi Lin, Hsin-Yu Chen, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen +3 more | 2025-06-03 |