Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334464 | Encapsulated package including device dies connected via interconnect die | Kuo-Chiang Ting, Chi-Hsi Wu, Shang-Yun Hou, Chia-Hao Hsu, Ting-Yu Yeh | 2025-06-17 |
| 12322729 | Semiconductor device | Weiming Chris Chen, Kuo-Chiang Ting, Shang-Yun Hou, Chi-Hsi Wu | 2025-06-03 |