Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12327815 | Integrated circuit package and method of forming the same | Der-Chyang Yeh, Sung-Feng Yeh | 2025-06-10 |
| 12322673 | 3DIC with heat dissipation structure and warpage control | Kuo-Chiang Ting, Sung-Feng Yeh, Ta Hao Sung | 2025-06-03 |
| 12272622 | Package and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh | 2025-04-08 |