Issued Patents 2025
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12421600 | 2-in-1 (UV-assisted and plasma enhanced) ALD and ALE chamber | Ta-Hao Kuo, CHING-LIANG YI | 2025-09-23 |
| 12409612 | Bonding method and apparatus of substrates | Pei-Yun Chiang | 2025-09-09 |
| 12403685 | Plate cooling device and de-bonding station with plate cooling device | Ta-Hao Kuo | 2025-09-02 |
| 12381114 | Package structure with fan-out feature | Ling Li, Cheng-Lin Huang | 2025-08-05 |
| 12368123 | Package structure including stacked pillar portions and method for fabricating the same | Szu-Wei Lu, Ying-Ching Shih | 2025-07-22 |
| 12272663 | Metal-bump sidewall protection | Jian-Yang He, Chin-Fu Kao | 2025-04-08 |
| 12264817 | Manufacturing method of optical device, optical device with quantum dots, and illumination apparatus with quantum dots | CHING-LIANG YI, Chen-Yang Huang | 2025-04-01 |
| 12255173 | Chip package structure | Ling Li, Cheng-Lin Huang | 2025-03-18 |