Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381114 | Package structure with fan-out feature | Ling Li, Jung-Hua Chang | 2025-08-05 |
| 12275135 | Humanoid finger mechanism | Hongliang Hua, Shihong Wu, Xiaofeng Wu, Yongjiang Chen, Xiaojun Wang | 2025-04-15 |
| 12255173 | Chip package structure | Ling Li, Jung-Hua Chang | 2025-03-18 |