Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
HL

Hui-Ting Lin

TSMC: 1 patents #2,025 of 3,957Top 55%
📍 Tainan, TW: #286 of 764 inventorsTop 40%
Overall (2025): #364,398 of 469,880Top 80%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12293951 Semiconductor package structure having ring portion with recess for adhesive Chin-Fu Kao, Chen-Shien Chen 2025-05-06