Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
SW

Shou-Yi Wang

TSMC: 1 patents #2,025 of 3,957Top 55%
Overall (2025): #214,974 of 469,880Top 50%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12249564 Package structure, RDL structure comprising redistribution layer having ground plates and signal lines Chien-Hsun Chen, Jiun Yi Wu 2025-03-11