Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406961 | Integrated circuit package and method | Chung-Shi Liu, Yu-Chia Lai, Kuo Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh +4 more | 2025-09-02 |
| 12374592 | Semiconductor device and manufacturing method thereof | Cheng-Chieh Wu, Ting Hao Kuo, Kuo Lung Pan, Po-Yuan Teng, Yu-Chia Lai +7 more | 2025-07-29 |
| 12278208 | Method of fabricating semiconductor structure including a barrier structure in between a plurality of surface mount components and a wafer | Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin, Tin-Hao Kuo +2 more | 2025-04-15 |