Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12358194 | Molded semiconductor device and manufacturing method of molded semiconductor device | Sheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Yao-Tong Lai +1 more | 2025-07-15 |
| 12354997 | Package structure and manufacturing method thereof | Chia-Min Lin, Tzu-Ting Chou, Sheng-Feng Weng, Chao-Wei Li, Chih-Wei Lin +1 more | 2025-07-08 |
| 12230549 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Ching-Hua Hsieh, Chih-Wei Lin, Sheng-Feng Weng, Yao-Tong Lai | 2025-02-18 |
| 12218082 | Package structure | Kai-Ming Chiang, Chao-Wei Li, Wei-Lun Tsai, Chia-Min Lin, Yi-Da Tsai +4 more | 2025-02-04 |