Issued Patents 2025
Showing 51–75 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308343 | Semiconductor device and method of forming the same | Jiun Yi Wu, Shang-Yun Hou | 2025-05-20 |
| 12300659 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chien Ling Hwang, Chih-Wei Lin, Ching-Hua Hsieh, Chung-Shi Liu | 2025-05-13 |
| 12300656 | Semiconductor package and method of forming thereof | Jiun Yi Wu | 2025-05-13 |
| 12300575 | Semiconductor package and method | Chuei-Tang Wang, Shih-Chang Ku, Chien-Yuan Huang | 2025-05-13 |
| 12300571 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai +2 more | 2025-05-13 |
| 12300646 | Chiplets 3D SoIC system integration and fabrication methods | Kuo-Chung Yee | 2025-05-13 |
| 12302677 | Semiconductor device and method | Keng-Han Lin, Hung-Jui Kuo, Hui-Jung Tsai | 2025-05-13 |
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin +8 more | 2025-05-06 |
| 12293991 | Semiconductor packages and methods of forming same | Chih-Hang Tung, Kuo-Chung Yee | 2025-05-06 |
| 12283556 | Package structure | Chun-Hui Yu, Kuo-Chung Yee | 2025-04-22 |
| 12283492 | Photonic integrated package and method forming same | An-Jhih Su, Wei-Yu Chen | 2025-04-22 |
| 12278214 | Integrated circuit package and method | Chuei-Tang Wang, Chieh-Yen Chen, Wei Ling Chang | 2025-04-15 |
| 12276838 | Semiconductor device and manufacturing method thereof having grating coupled dies and nanostructures | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Tsang-Jiuh Wu, Wen-Chih Chiou | 2025-04-15 |
| 12272637 | Integrated fan-out package with 3D magnetic core inductor | Wen-Shiang Liao, Chih-Hang Tung, Chewn-Pu Jou, Feng-Wei Kuo | 2025-04-08 |
| 12272631 | Semiconductor package having multiple substrates | Jiun Yi Wu | 2025-04-08 |
| 12272616 | Heat-dissipating structures for semiconductor devices and methods of manufacture | Tung-Liang Shao, Yu-Sheng Huang, Shih-Chang Ku, Chuei-Tang Wang | 2025-04-08 |
| 12266619 | Integrated devices in semiconductor packages and methods of forming same | Kai-Chiang Wu, Chung-Shi Liu, Shou-Zen Chang, Chao-Wen Shih | 2025-04-01 |
| 12266612 | Method for forming a semiconductor device including forming a first interconnect structure on one side of a substrate having first metal feature closer the substrate than second metal feature and forming first and second tsv on other side of substrate connecting to the metal features | Hsien-Pin Hu, Ming-Fa Chen, Jing-Cheng Lin, Jiun-Ren Lai, Yung-Chi Lin | 2025-04-01 |
| 12265330 | Polymer material in a redistribution structure of a semiconductor package and method of manufacture | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-04-01 |
| 12261142 | Semiconductor structure including thermal enhanced bonding structure | Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2025-03-25 |
| 12259578 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Kuo-Chiang Ting, Shang-Yun Hou | 2025-03-25 |
| 12260669 | Fingerprint sensor in InFO structure and formation method | Chih-Hua Chen, Yu-Feng Chen, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chih Huang | 2025-03-25 |
| 12253729 | Optical transceiver and manufacturing method thereof | Hsing-Kuo Hsia, Sung-Hui Huang, Kuan-Yu Huang, Kuo-Chiang Ting, Shang-Yun Hou +1 more | 2025-03-18 |
| 12255079 | Semiconductor package and method of manufacturing the same | Chin-Chuan Chang, Szu-Wei Lu | 2025-03-18 |
| 12255174 | Bonding passive devices on active dies to form 3D packages | Kuo Lung Pan, Shu-Rong Chun, Chi-Hui Lai, Tin-Hao Kuo, Hao-Yi Tsai +1 more | 2025-03-18 |