Issued Patents 2025
Showing 76–100 of 116 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12255184 | Semiconductor packages and methods of forming the same | Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang, Tin-Hao Kuo, Hao-Yi Tsai | 2025-03-18 |
| 12249587 | Semiconductor structure and forming method thereof | Jiun Yi Wu, Yu-Min Liang, Jung Wei Cheng | 2025-03-11 |
| 12249518 | Semiconductor device comprising interconnect structures | Jiun Yi Wu | 2025-03-11 |
| 12249581 | Method of manufacture overlay mark using laser marking process for semiconductor device | Jing-Cheng Lin, Po-Hao Tsai | 2025-03-11 |
| 12243843 | Integrated circuit package and method of forming same | Jiun Yi Wu | 2025-03-04 |
| 12242108 | Photonic semiconductor device and method of manufacture | Hsing-Kuo Hsia, Kuo-Chiang Ting, Sung-Hui Huang, Shang-Yun Hou, Chi-Hsi Wu | 2025-03-04 |
| 12242197 | Apparatus, system and method | Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-03-04 |
| 12243681 | Programmable inductor and methods of manufacture | Mirng-Ji Lii, Hao-Yi Tsai, Hsien-Wei Chen, Hung-Yi Kuo, Nien-Fang Wu | 2025-03-04 |
| 12243829 | Semiconductor package including cavity-mounted device | Jiun Yi Wu | 2025-03-04 |
| 12237238 | Package structure and method | Jing-Cheng Lin, Szu-Wei Lu | 2025-02-25 |
| 12238865 | Integrated circuit structure | Jui-Pin Hung, Kuo-Chung Yee | 2025-02-25 |
| 12228776 | Package with integrated optical die and method forming same | Jiun Yi Wu | 2025-02-18 |
| 12230513 | Cross-wafer RDLs in constructed wafers | Tin-Hao Kuo | 2025-02-18 |
| 12222545 | Package and method of forming same | Chih-Hsuan Tai, Chung-Ming Weng, Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai +1 more | 2025-02-11 |
| 12224247 | Fan-out package having a main die and a dummy die | Yan-Fu Lin, Meng-Tsan Lee, Wei-Cheng Wu, Hsien-Wei Chen | 2025-02-11 |
| 12224276 | 3D semiconductor packages | Chun-Hui Yu, Kuo-Chung Yee, Liang-Ju Yen | 2025-02-11 |
| 12218026 | Package structure for heat dissipation | Sung-Feng Yeh, Ming-Fa Chen | 2025-02-04 |
| 12218006 | System, device and methods of manufacture | Wei Ling Chang, Chuei-Tang Wang, Tin-Hao Kuo, Che-Wei Hsu | 2025-02-04 |
| 12218009 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-02-04 |
| 12218020 | Semiconductor packages | Jiun Yi Wu, Chung-Shi Liu, Yu-Min Liang | 2025-02-04 |
| 12218022 | Passivation structure with planar top surfaces | Yi-Hsiu Chen, Wen-Chih Chiou | 2025-02-04 |
| 12217976 | Method of fabricating package | Jiun Yi Wu | 2025-02-04 |
| 12218089 | Packaged semiconductor device and method of forming thereof | Kuo-Chung Yee, Chih-Hang Tung | 2025-02-04 |
| 12218093 | Semiconductor die connection system and method | Ming-Fa Chen, Sen-Bor Jan | 2025-02-04 |
| 12211779 | Semiconductor package having multiple substrates | Jiun Yi Wu | 2025-01-28 |