Issued Patents 2025
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh +8 more | 2025-09-02 |
| 12399545 | Power management watchdog | Thiam Wah Loh, Wei Shun Chang | 2025-08-26 |
| 12400876 | Methods of manufacture having redistribution layer using dielectric material photoactive component | Yu-Hsiang Hu, Hung-Jui Kuo, Sih-Hao Liao | 2025-08-26 |
| 12374674 | Semiconductor structure and semiconductor device | Tzu-Wei Chiu, Chun-Wei Chang, Shang-Pin Chen, Che-Yen Huang | 2025-07-29 |
| 12332295 | Wafer inspection system | Shen-Hao Tsai, Yi-Yen Lin | 2025-06-17 |
| 12322688 | Package structure including auxiliary dielectric portion | Po-Han Wang, Sih-Hao Liao, Hung-Chun Cho, Ting-Chen Tseng, Yu-Hsiang Hu +1 more | 2025-06-03 |
| 12293988 | Semiconductor package and method of forming the same | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao, Hung-Chun Cho | 2025-05-06 |
| 12283545 | Package structure and method of manufacturing the same | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu | 2025-04-22 |
| 12242150 | Electronic device | Chih-Ming Liang | 2025-03-04 |
| 12224227 | Method for manufacturing semiconductor structure with power connecting structures under transistors and semiconductor structure with power connecting structures under transistors | Tzu-Wei Chiu | 2025-02-11 |
| 12218009 | Semiconductor package and methods of forming the same | Meng-Che Tu, Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2025-02-04 |
| 12204364 | Systems and methods for multi-phase clock generation | — | 2025-01-21 |
| 12191222 | Integrated fan out device with a filler-free insulating material | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-01-07 |