TT

Ting-Chen Tseng

TSMC: 2 patents #1,333 of 3,957Top 35%
Overall (2025): #80,298 of 469,880Top 20%
2
Patents 2025

Issued Patents 2025

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
12412856 Package structure and method of manufacturing the same Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao 2025-09-09
12322688 Package structure including auxiliary dielectric portion Po-Han Wang, Sih-Hao Liao, Wei-Chih Chen, Hung-Chun Cho, Yu-Hsiang Hu +1 more 2025-06-03