Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394741 | Integrated circuit packages having adhesion layers for through vias | Sih-Hao Liao, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-08-19 |
| 12322688 | Package structure including auxiliary dielectric portion | Po-Han Wang, Sih-Hao Liao, Wei-Chih Chen, Ting-Chen Tseng, Yu-Hsiang Hu +1 more | 2025-06-03 |
| 12293988 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2025-05-06 |
| 12249588 | Semiconductor device and methods of manufacture | Hung-Jui Kuo, Yu-Hsiang Hu, Sih-Hao Liao | 2025-03-11 |