Issued Patents 2025
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412867 | Integrated fan-out package and manufacturing method thereof | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Yung-Chi Chu | 2025-09-09 |
| 12412856 | Package structure and method of manufacturing the same | Ting-Chen Tseng, Hung-Jui Kuo, Yu-Hsiang Hu | 2025-09-09 |
| 12400876 | Methods of manufacture having redistribution layer using dielectric material photoactive component | Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-08-26 |
| 12394741 | Integrated circuit packages having adhesion layers for through vias | Hung-Chun Cho, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-08-19 |
| 12334433 | Semiconductor device and method of fabricating the same | Hung-Jui Kuo, Yu-Hsiang Hu | 2025-06-17 |
| 12322688 | Package structure including auxiliary dielectric portion | Po-Han Wang, Wei-Chih Chen, Hung-Chun Cho, Ting-Chen Tseng, Yu-Hsiang Hu +1 more | 2025-06-03 |
| 12315772 | Package and manufacturing method thereof | Yung-Chi Chu, Hung-Jui Kuo, Yu-Hsiang Hu | 2025-05-27 |
| 12298667 | Lithography | Meng-Che Tu, Po-Han Wang, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-05-13 |
| 12293988 | Semiconductor package and method of forming the same | Wei-Chih Chen, Hung-Jui Kuo, Yu-Hsiang Hu, Hung-Chun Cho | 2025-05-06 |
| 12265330 | Polymer material in a redistribution structure of a semiconductor package and method of manufacture | Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2025-04-01 |
| 12249588 | Semiconductor device and methods of manufacture | Hung-Chun Cho, Hung-Jui Kuo, Yu-Hsiang Hu | 2025-03-11 |
| 12218009 | Semiconductor package and methods of forming the same | Meng-Che Tu, Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo, Chen-Hua Yu | 2025-02-04 |
| 12211802 | Package structure and method of fabricating the same | Jhih-Yu Wang, Hung-Jui Kuo, Yu-Hsiang Hu, Yung-Chi Chu | 2025-01-28 |
| 12191222 | Integrated fan out device with a filler-free insulating material | Wei-Chih Chen, Yu-Hsiang Hu, Hung-Jui Kuo | 2025-01-07 |