Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
CY

Chen-Hua Yu

TSMC: 114 patents #2 of 3,957Top 1%
PF Parabellum Strategic Opportunities Fund: 2 patents #1 of 20Top 5%
📍 Hsinchu, TW: #1 of 3 inventorsTop 35%
Overall (2025): #61 of 469,880Top 1%
116
Patents 2025

Issued Patents 2025

Showing 101–116 of 116 patents

Patent #TitleCo-InventorsDate
12211801 Chip package and method of forming the same Yu-Hsiang Hu, Hung-Jui Kuo 2025-01-28
12210200 Photonic semiconductor device and method of manufacture Chung-Ming Weng, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh, Hung-Yi Kuo +3 more 2025-01-28
12210188 Semiconductor package and manufacturing method thereof Hung-Yi Kuo, Cheng-Chieh Hsieh, Che-Hsiang Hsu, Chung-Ming Weng, Tsung-Yuan Yu 2025-01-28
12209015 MEMS packages and methods of manufacture thereof Kuo-Chung Yee 2025-01-28
12205923 Semiconductor device, circuit board structure and manufacturing method thereof Tin-Hao Kuo, Chung-Shi Liu, Hao-Yi Tsai, Yu-Chia Lai, Po-Yuan Teng 2025-01-21
12205879 Symmetrical substrate for semiconductor packaging Jiun Yi Wu 2025-01-21
12205860 Sensor packages Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more 2025-01-21
12199080 Electronics card including multi-chip module Chien-Hsun Lee, Jiun Yi Wu 2025-01-14
12199065 Multi-die package structures including redistribution layers Kuo-Chung Yee, Tsung-Ding Wang, Chien-Hsun Lee 2025-01-14
12199051 Integrated circuit structure and method Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai 2025-01-14
12199024 Semiconductor device and method of manufacture Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen, Tzuan-Horng Liu 2025-01-14
12193168 Circuit board and semiconductor device including the same Jiun Yi Wu, Chien-Hsun Lee, Chung-Shi Liu 2025-01-07
12191279 Integrated circuit packages and methods of forming the same Kuo-Chung Yee 2025-01-07
12191270 Integrated circuit package and method of forming same Chuei-Tang Wang, Wei Ling Chang, Chieh-Yen Chen 2025-01-07
12191251 Semiconductor device and method of manufacture Jiun Yi Wu, Chien-Hsun Chen 2025-01-07
12191224 Semiconductor package and manufacturing method thereof Wei-Chih Lai, Chien-Chia Chiu, Der-Chyang Yeh, Cheng-Hsien Hsieh, Li-Han Hsu +3 more 2025-01-07