Issued Patents All Time
Showing 25 most recent of 78 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11825592 | Electronic device console with natural draft cooling | Kamal K. Sikka, Chenzhou Lian, Kathryn C. Rivera, Paul F. Bodenweber | 2023-11-21 |
| 11569181 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Sushumna Iruvanti, Shidong Li, Steve Ostrander, Brian R. Sundlof | 2023-01-31 |
| 11410894 | Polygon integrated circuit (IC) packaging | Charles L. Arvin, Richard F. Indyk, Bhupender Singh, Shidong Li | 2022-08-09 |
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin +5 more | 2021-11-16 |
| 11031343 | Fins for enhanced die communication | Charles L. Arvin, Richard F. Indyk, Bhupender Singh | 2021-06-08 |
| 10892233 | Mitigating moisture-driven degradation of features designed to prevent structural failure of semiconductor wafers | Sushumna Iruvanti, Shidong Li, Steve Ostrander, Brian R. Sundlof | 2021-01-12 |
| 10834808 | Electronic device console with natural draft cooling | Paul F. Bodenweber, Chenzhou Lian, Kathryn C. Rivera, Kamal K. Sikka | 2020-11-10 |
| 10580738 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta, Charles L. Arvin +5 more | 2020-03-03 |
| 9601423 | Under die surface mounted electrical elements | Charles L. Arvin, Brian M. Erwin, Steven P. Ostrander, Brian W. Quinlan | 2017-03-21 |
| 9477568 | Managing interconnect electromigration effects | Malcolm S. Allen-Ware, Sungjun Chun, Alan J. Drake, Charles R. Lefurgy, Karthick Rajamani +3 more | 2016-10-25 |
| 9226426 | Electronic device console with natural draft cooling | Paul F. Bodenweber, Chenzhou Lian, Kathryn C. Rivera, Kamal K. Sikka | 2015-12-29 |
| 8786059 | Passivation layer surface topography modifications for improved integrity in packaged assemblies | Alexandre Blander, Timothy H. Daubenspeck, Ian D. Melville, Jennifer V. Muncy, Marie-Claude Paquet | 2014-07-22 |
| 8680670 | Multi-chip module system with removable socketed modules | John L. Colbert, Paul M. Harvey, Mark K. Hoffmeyer, Charles L. Reynolds | 2014-03-25 |
| 8421217 | Achieving mechanical and thermal stability in a multi-chip package | John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav, Roger A. Liptak +4 more | 2013-04-16 |
| 8236615 | Passivation layer surface topography modifications for improved integrity in packaged assemblies | Alexandre Blander, Timothy H. Daubenspeck, Ian D. Melville, Jennifer V. Muncy, Marie-Claude Paquet | 2012-08-07 |
| 8214658 | Enhanced thermal management for improved module reliability | Michael Stephen Floyd, Soraya Ghiasi, Kenneth C. Marston, Jennifer V. Muncy, Malcolm S. Ware +1 more | 2012-07-03 |
| 8202765 | Achieving mechanical and thermal stability in a multi-chip package | John Saunders Corbin, Jr., David Danovitch, Isabelle Depatie, Virendra R. Jadhav, Roger A. Liptak +4 more | 2012-06-19 |
| 8119206 | Negative coefficient of thermal expansion particles | Gareth G. Hougham, Xiao Hu Liu, S. Jay Chey, Joseph Zinter, Michael J. Rooks +1 more | 2012-02-21 |
| 7917328 | Tracking thermal mini-cycle stress | Michael Stephen Floyd, Soraya Ghiasi, Kenneth C. Marston, Jennifer V. Muncy, Malcom S. Ware +1 more | 2011-03-29 |
| 7875502 | Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners | Peter J. Brofman, Ian D. Melville, David L. Questad, Wolfgang Sauter, Thomas A. Wassick | 2011-01-25 |
| 7815968 | Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation | Gareth G. Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Claudius Feger, Matteo Flotta +5 more | 2010-10-19 |
| 7732932 | Semiconductor chips with crack stop regions for reducing crack propagation from chip edges/corners | Peter J. Brofman, Ian D. Melville, David L. Questad, Wolfgang Sauter, Thomas A. Wassick | 2010-06-08 |
| 7579069 | Negative coefficient of thermal expansion particles and method of forming the same | Gareth G. Hougham, Xiao Hu Liu, S. Jay Chey, James P. Doyle, Joseph Zinter +2 more | 2009-08-25 |
| 7452568 | Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation | Gareth G. Hougham, Leena Paivikki Buchwalter, Stephen L. Buchwalter, Claudius Feger, Matteo Flotta +5 more | 2008-11-18 |
| 7449067 | Method and apparatus for filling vias | Paul S. Andry, Raymond R. Horton, Chiraq S. Patel, Edmund J. Sprogis, Brian R. Sundlof | 2008-11-11 |