| 11832419 |
Full package vapor chamber with IHS |
Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more |
2023-11-28 |
| 11824018 |
Heterogeneous nested interposer package for IC chips |
Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha |
2023-11-21 |
| 11817444 |
Multi-chip packaging |
Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more |
2023-11-14 |
| 11798887 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik |
2023-10-24 |
| 11764158 |
Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same |
Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama |
2023-09-19 |
| 11756860 |
Semiconductor device stack-up with bulk substrate material to mitigate hot spots |
Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Xavier Francois Brun, Pooya Tadayon |
2023-09-12 |
| 11756889 |
Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making |
Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan |
2023-09-12 |
| 11735533 |
Heterogeneous nested interposer package for IC chips |
Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha |
2023-08-22 |
| 11705377 |
Stacked die cavity package |
Mitul Modi, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more |
2023-07-18 |
| 11694959 |
Multi-die ultrafine pitch patch architecture and method of making |
Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan |
2023-07-04 |
| 11658122 |
EMIB patch on glass laminate substrate |
Robert Alan May |
2023-05-23 |
| 11652057 |
Disaggregated die interconnection with on-silicon cavity bridge |
Khang Choong Yong, Eng Huat Goh, Min Suet Lim, Telesphor Kamgaing, Wil Choon Song +1 more |
2023-05-16 |
| 11652020 |
Thermal solutions for multi-package assemblies and methods for fabricating the same |
Chia-Pin Chiu |
2023-05-16 |
| 11626395 |
Thermal spreading management of 3D stacked integrated circuits |
Pooya Tadayon, Weihua Tang, Chandra Mohan Jha, Zhimin Wan |
2023-04-11 |
| 11581287 |
Chip scale thin 3D die stacked package |
Sanka Ganesan, Bernd Waidhas, Thomas Wagner, Lizabeth Keser |
2023-02-14 |
| 11545441 |
Semiconductor package having wafer-level active die and external die mount |
Vipul V. Mehta, Eric J. Li, Sanka Ganesan, Debendra Mallik |
2023-01-03 |