Issued Patents 2023
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more | 2023-11-28 |
| 11824018 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2023-11-21 |
| 11817444 | Multi-chip packaging | Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2023-11-14 |
| 11798887 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik | 2023-10-24 |
| 11764158 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama | 2023-09-19 |
| 11756860 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Xavier Francois Brun, Pooya Tadayon | 2023-09-12 |
| 11756889 | Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan | 2023-09-12 |
| 11735533 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2023-08-22 |
| 11705377 | Stacked die cavity package | Mitul Modi, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2023-07-18 |
| 11694959 | Multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan | 2023-07-04 |
| 11658122 | EMIB patch on glass laminate substrate | Robert Alan May | 2023-05-23 |
| 11652057 | Disaggregated die interconnection with on-silicon cavity bridge | Khang Choong Yong, Eng Huat Goh, Min Suet Lim, Telesphor Kamgaing, Wil Choon Song +1 more | 2023-05-16 |
| 11652020 | Thermal solutions for multi-package assemblies and methods for fabricating the same | Chia-Pin Chiu | 2023-05-16 |
| 11626395 | Thermal spreading management of 3D stacked integrated circuits | Pooya Tadayon, Weihua Tang, Chandra Mohan Jha, Zhimin Wan | 2023-04-11 |
| 11581287 | Chip scale thin 3D die stacked package | Sanka Ganesan, Bernd Waidhas, Thomas Wagner, Lizabeth Keser | 2023-02-14 |
| 11545441 | Semiconductor package having wafer-level active die and external die mount | Vipul V. Mehta, Eric J. Li, Sanka Ganesan, Debendra Mallik | 2023-01-03 |