| 11830831 |
Semiconductor package including a modular side radiating waveguide launcher |
Georgios Dogiamis, Sasha N. Oster, Johanna M. Swan, Adel A. Elsherbini, Telesphor Kamgaing +1 more |
2023-11-28 |
| 11824018 |
Heterogeneous nested interposer package for IC chips |
Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Srinivas V. Pietambaram, Bharat P. Penmecha |
2023-11-21 |
| 11791277 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan |
2023-10-17 |
| 11769751 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan |
2023-09-26 |
| 11756943 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan |
2023-09-12 |
| 11749642 |
Microelectronic assemblies with communication networks |
Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Johanna M. Swan |
2023-09-05 |
| 11749649 |
Composite IC chips including a chiplet embedded within metallization layers of a host IC chip |
Adel A. Elsherbini, Johanna M. Swan, Patrick Morrow, Gerald Pasdast, Van H. Le |
2023-09-05 |
| 11735551 |
Aligned core balls for interconnect joint stability |
Jimin Yao, Xin Yan, Numair Ahmed |
2023-08-22 |
| 11735533 |
Heterogeneous nested interposer package for IC chips |
Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Srinivas V. Pietambaram, Bharat P. Penmecha |
2023-08-22 |
| 11721649 |
Microelectronic assemblies |
Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Brennen Mueller +2 more |
2023-08-08 |
| 11694986 |
Vias in composite IC chip structures |
Adel A. Elsherbini, Patrick Morrow, Johanna M. Swan, Mauro Kobrinksy, Van H. Le +1 more |
2023-07-04 |
| 11676900 |
Electronic assembly that includes a bridge |
Eric J. Li, Nitin A. Deshpande, Omkar G. Karhade, Amram Eitan, Timothy A. Gosselin |
2023-06-13 |
| 11664303 |
Interconnection structure fabrication using grayscale lithography |
Johanna M. Swan, Henning Braunisch, Aleksandar Aleksov, Brandon M. Rawlings, Veronica Strong |
2023-05-30 |
| 11616047 |
Microelectronic assemblies |
Adel A. Elsherbini, Feras Eid, Johanna M. Swan |
2023-03-28 |
| 11605603 |
Microelectronic package with radio frequency (RF) chiplet |
Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan +1 more |
2023-03-14 |
| 11600594 |
Microelectronic assemblies |
Adel A. Elsherbini, Johanna M. Swan, Arun Chandrasekhar |
2023-03-07 |
| 11581282 |
Serializer-deserializer die for high speed signal interconnect |
Adel A. Elsherbini, Johanna M. Swan, Gerald Pasdast |
2023-02-14 |
| 11581238 |
Heat spreading layer integrated within a composite IC die structure and methods of forming the same |
Adel A. Elsherbini, Johanna M. Swan, Jimin Yao, Veronica Strong |
2023-02-14 |
| 11569428 |
Superconducting qubit device packages |
Jeanette M. Roberts, Adel A. Elsherbini, Johanna M. Swan, Roman Caudillo, Zachary R. Yoscovits +4 more |
2023-01-31 |
| 11552035 |
Electronic package with stud bump electrical connections |
Zhaozhi Li, Sanka Ganesan, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu +1 more |
2023-01-10 |