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Microelectronic component having molded regions with through-mold vias |
Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more |
2023-11-14 |
| 11804426 |
Integrated circuit structures in package substrates |
William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali, Stephen Andrew Smith, Michael J. Hill +1 more |
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| 11756889 |
Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making |
Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman |
2023-09-12 |
| 11694959 |
Multi-die ultrafine pitch patch architecture and method of making |
Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman |
2023-07-04 |
| 11640942 |
Microelectronic component having molded regions with through-mold vias |
Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba, Manish Dubey +1 more |
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| 11581287 |
Chip scale thin 3D die stacked package |
Robert L. Sankman, Bernd Waidhas, Thomas Wagner, Lizabeth Keser |
2023-02-14 |
| 11574851 |
Coupled cooling fins in ultra-small systems |
Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more |
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| 11552035 |
Electronic package with stud bump electrical connections |
Zhaozhi Li, Debendra Mallik, Gregory Perry, Kuan-Hsun Lu, Omkar G. Karhade +1 more |
2023-01-10 |
| 11545407 |
Thermal management solutions for integrated circuit packages |
Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more |
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| 11545441 |
Semiconductor package having wafer-level active die and external die mount |
Vipul V. Mehta, Eric J. Li, Debendra Mallik, Robert L. Sankman |
2023-01-03 |