Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817390 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more | 2023-11-14 |
| 11688692 | Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias | Praneeth Akkinepally, Frank Truong, Robert Alan May | 2023-06-27 |
| 11640942 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Manish Dubey +1 more | 2023-05-02 |