Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854834 | Integrated circuit package supports | Kristof Darmawikarta, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2023-12-26 |
| 11817390 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more | 2023-11-14 |
| 11784128 | Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate | Kristof Darmawikarta, Sri Ranga Sai Boyapati | 2023-10-10 |
| 11764158 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Islam A. Salama, Robert L. Sankman | 2023-09-19 |
| 11735531 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2023-08-22 |
| 11721631 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh +2 more | 2023-08-08 |
| 11699648 | Electromigration resistant and profile consistent contact arrays | Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more | 2023-07-11 |
| 11688692 | Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias | Praneeth Akkinepally, Frank Truong, Jason M. Gamba | 2023-06-27 |
| 11658122 | EMIB patch on glass laminate substrate | Robert L. Sankman | 2023-05-23 |
| 11640942 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more | 2023-05-02 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram, Frank Truong +4 more | 2023-02-07 |
| 11552010 | Dielectric for high density substrate interconnects | Andrew J. Brown, Sri Ranga Sai Boyapati, Kristof Darmawikarta | 2023-01-10 |