| 11854834 |
Integrated circuit package supports |
Kristof Darmawikarta, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov |
2023-12-26 |
| 11817390 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more |
2023-11-14 |
| 11784128 |
Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate |
Kristof Darmawikarta, Sri Ranga Sai Boyapati |
2023-10-10 |
| 11764158 |
Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same |
Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Islam A. Salama, Robert L. Sankman |
2023-09-19 |
| 11735531 |
Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers |
Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim |
2023-08-22 |
| 11721631 |
Via structures having tapered profiles for embedded interconnect bridge substrates |
Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh +2 more |
2023-08-08 |
| 11699648 |
Electromigration resistant and profile consistent contact arrays |
Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON +3 more |
2023-07-11 |
| 11688692 |
Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias |
Praneeth Akkinepally, Frank Truong, Jason M. Gamba |
2023-06-27 |
| 11658122 |
EMIB patch on glass laminate substrate |
Robert L. Sankman |
2023-05-23 |
| 11640942 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more |
2023-05-02 |
| 11574874 |
Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch |
Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram, Frank Truong +4 more |
2023-02-07 |
| 11552010 |
Dielectric for high density substrate interconnects |
Andrew J. Brown, Sri Ranga Sai Boyapati, Kristof Darmawikarta |
2023-01-10 |