Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764158 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama, Robert L. Sankman | 2023-09-19 |
| 11705377 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Yikang Deng +1 more | 2023-07-18 |
| 11676950 | Via-in-via structure for high density package integrated inductor | Krishna Bharath, Sriram Srinivasan, Kaladhar Radhakrishnan, Huong Do, William J. Lambert | 2023-06-13 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more | 2023-05-30 |
| 11658111 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Debendra Mallik | 2023-05-23 |
| 11581271 | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate | Rahul Jain, Kyu Oh Lee, Islam A. Salama, Wei-Lun Kane Jen, Yongki Min +1 more | 2023-02-14 |
| 11552019 | Substrate patch reconstitution options | Haifa Hariri, Wei-Lun Kane Jen, Islam A. Salama | 2023-01-10 |