YD

Yikang Deng

IN Intel: 6 patents #350 of 4,378Top 8%
TR Tahoe Research: 1 patents #11 of 144Top 8%
Overall (2023): #11,167 of 537,848Top 3%
8
Patents 2023

Issued Patents 2023

Patent #TitleCo-InventorsDate
11830809 Magnetic structures in integrated circuit package supports Ying Wang, Junnan Zhao, Andrew J. Brown, Cheng Xu, Kaladhar Radhakrishnan 2023-11-28
11769719 Dual trace thickness for single layer routing Jonathan L. Rosch, Wei-Lun Kane Jen, Cheng Xu, Liwei Cheng, Andrew J. Brown 2023-09-26
11705377 Stacked die cavity package Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur +1 more 2023-07-18
11696407 Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate Chong Zhang, Ying Wang, Junnan Zhao, Cheng Xu 2023-07-04
11651885 Magnetic core inductors Junnan Zhao, Ying Wang, Cheng Xu, Kyu Oh Lee, Sheng Li 2023-05-16
11646254 Electronic device including a lateral trace Ying Wang, Cheng Xu, Chong Zhang, Junnan Zhao 2023-05-09
11608564 Helical plated through-hole package inductor William J. Lambert, Mihir K. Roy, Mathew J. Manusharow 2023-03-21
D977208 Litter box 2023-01-31