Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664320 | High density interconnect device and method | Mathew J. Manusharow | 2023-05-30 |
| 11637050 | Package architecture utilizing wafer to wafer bonding | Anthony M. Chiu, Robert Charles Dry | 2023-04-25 |
| 11608564 | Helical plated through-hole package inductor | William J. Lambert, Mathew J. Manusharow, Yikang Deng | 2023-03-21 |