Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791528 | Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line | Adel A. Elsherbini, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen, Aleksandar Aleksov +3 more | 2023-10-17 |
| 11715695 | Size and efficiency of dies | Jonathan Rosenfeld | 2023-08-01 |
| 11688729 | Integrated thin film capacitors on a glass core substrate | Adel A. Elsherbini, Krishna Bharath | 2023-06-27 |
| 11664320 | High density interconnect device and method | Mihir K. Roy | 2023-05-30 |
| 11608564 | Helical plated through-hole package inductor | William J. Lambert, Mihir K. Roy, Yikang Deng | 2023-03-21 |