Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791528 | Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Aleksandar Aleksov +3 more | 2023-10-17 |
| 11742293 | Multiple die package using an embedded bridge connecting dies | Kemel Aygun, Ravindranath V. Mahajan, Christopher S. Baldwin, Rajasekaran Swaminathan | 2023-08-29 |
| 11694952 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Kemal Aygun, Zhiguo Qian, Zhichao Zhang, Jianyong Xie | 2023-07-04 |
| 11545416 | Minimization of insertion loss variation in through-silicon vias (TSVs) | Jianyong Xie, Zhiguo Qian, Kemal Aygun | 2023-01-03 |