Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837549 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Zhiguo Qian | 2023-12-05 |
| 11817391 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Zhiguo Qian | 2023-11-14 |
| 11728294 | Capacitor die embedded in package substrate for providing capacitance to surface mounted die | Andrew Collins, Sujit Sharan | 2023-08-15 |
| 11694952 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Kemal Aygun, Zhiguo Qian, Yidnekachew S. Mekonnen, Zhichao Zhang | 2023-07-04 |
| 11621227 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Zhiguo Qian | 2023-04-04 |
| 11621223 | Interconnect hub for dies | Andrew Collins, Sujit Sharan | 2023-04-04 |
| 11610862 | Semiconductor packages with chiplets coupled to a memory device | Andrew Collins | 2023-03-21 |
| 11545416 | Minimization of insertion loss variation in through-silicon vias (TSVs) | Yidnekachew S. Mekonnen, Zhiguo Qian, Kemal Aygun | 2023-01-03 |