| 11837549 |
Power delivery for embedded bridge die utilizing trench structures |
Zhiguo Qian, Jianyong Xie |
2023-12-05 |
| 11817391 |
Power delivery for embedded bridge die utilizing trench structures |
Zhiguo Qian, Jianyong Xie |
2023-11-14 |
| 11810859 |
Multi-layered adhesion promotion films |
Srinivas V. Pietambaram, Rahul N. Manepalli, Cemil Geyik |
2023-11-07 |
| 11742275 |
Ground via clustering for crosstalk mitigation |
Zhiguo Qian, Yu Zhang |
2023-08-29 |
| 11737227 |
Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket |
Zhichao Zhang, Gregorio R. Murtagian, Kuang Liu |
2023-08-22 |
| 11715889 |
Slow wave structure for millimeter wave antennas |
Zhichao Zhang, Jiwei Sun |
2023-08-01 |
| 11694952 |
Horizontal pitch translation using embedded bridge dies |
Sujit Sharan, Zhiguo Qian, Yidnekachew S. Mekonnen, Zhichao Zhang, Jianyong Xie |
2023-07-04 |
| 11682613 |
Package substrates with magnetic build-up layers |
Zhiguo Qian, Kaladhar Radhakrishnan |
2023-06-20 |
| 11621227 |
Power delivery for embedded bridge die utilizing trench structures |
Zhiguo Qian, Jianyong Xie |
2023-04-04 |
| 11574862 |
Optimal signal routing performance through dielectric material configuration designs in package substrate |
Zhiguo Qian, Gang Duan, Jieying Kong |
2023-02-07 |
| 11545416 |
Minimization of insertion loss variation in through-silicon vias (TSVs) |
Jianyong Xie, Yidnekachew S. Mekonnen, Zhiguo Qian |
2023-01-03 |