Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817349 | Conductive route patterning for electronic substrates | Jeremy Ecton, Brandon C. Marin, Leonel Arana, Matthew Tingey, Oscar Ojeda +3 more | 2023-11-14 |
| 11792216 | Application layer data protection for containers in a containerization environment | Fei Huang, Zang Li | 2023-10-17 |
| 11780210 | Glass dielectric layer with patterning | Jieying Kong, Srinivas V. Pietambaram, Patrick QUACH, Dilan Seneviratne | 2023-10-10 |
| 11769735 | Chiplet first architecture for die tiling applications | Srinivas V. Pietambaram, Deepak Kulkarni, Rahul N. Manepalli, Xiaoying Guo | 2023-09-26 |
| 11756890 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Rahul N. Manepalli | 2023-09-12 |
| 11646274 | Multi-package assemblies having foam structures for warpage control | Mufei Yu, Edvin Cetegen, Baris Bicen, Rahul N. Manepalli | 2023-05-09 |
| 11622448 | Sandwich-molded cores for high-inductance architectures | Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Andrew J. Brown, Jeremy Ecton +1 more | 2023-04-04 |
| 11574862 | Optimal signal routing performance through dielectric material configuration designs in package substrate | Zhiguo Qian, Kemal Aygun, Jieying Kong | 2023-02-07 |