Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11855125 | Capacitors with nanoislands on conductive plates | Srinivas V. Pietambaram, Brandon C. Marin, Hiroki Tanaka, Frank Truong | 2023-12-26 |
| 11817349 | Conductive route patterning for electronic substrates | Brandon C. Marin, Leonel Arana, Matthew Tingey, Oscar Ojeda, Hsin-Wei Wang +3 more | 2023-11-14 |
| 11791228 | Method for forming embedded grounding planes on interconnect layers | Brandon C. Marin, Kristof Darmawikarta, Roy Dittler, Darko Grujicic | 2023-10-17 |
| 11721631 | Via structures having tapered profiles for embedded interconnect bridge substrates | Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more | 2023-08-08 |
| 11721650 | Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package | Brandon C. Marin, Aleksandar Aleksov, Georgios Dogiamis, Suddhasattwa Nad, Mohammad Mamunur Rahman | 2023-08-08 |
| 11694898 | Hybrid fine line spacing architecture for bump pitch scaling | Suddhasattwa Nad, Bai Nie, Rahul N. Manepalli, Marcel Wall | 2023-07-04 |
| 11670504 | Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives | Brandon C. Marin, Andrew J. Brown, Dilan Seneviratne | 2023-06-06 |
| 11652071 | Electronic device package including a capacitor | Brandon C. Marin, Shivasubramanian Balasubramanian, Rahul Jain, Praneeth Akkinepally | 2023-05-16 |
| 11652036 | Via-trace structures | Hiroki Tanaka, Kristof Darmawikarta, Oscar Ojeda, Arnab Roy, Nicholas S. Haehn | 2023-05-16 |
| 11622448 | Sandwich-molded cores for high-inductance architectures | Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Andrew J. Brown, Gang Duan +1 more | 2023-04-04 |
| 11605867 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Aleksandar Aleksov, Kristof Darmawikarta, Yonggang Li, Dilan Seneviratne | 2023-03-14 |
| 11569160 | Patterning of dual metallization layers | — | 2023-01-31 |