| 11855125 |
Capacitors with nanoislands on conductive plates |
Srinivas V. Pietambaram, Brandon C. Marin, Hiroki Tanaka, Frank Truong |
2023-12-26 |
| 11817349 |
Conductive route patterning for electronic substrates |
Brandon C. Marin, Leonel Arana, Matthew Tingey, Oscar Ojeda, Hsin-Wei Wang +3 more |
2023-11-14 |
| 11791228 |
Method for forming embedded grounding planes on interconnect layers |
Brandon C. Marin, Kristof Darmawikarta, Roy Dittler, Darko Grujicic |
2023-10-17 |
| 11721631 |
Via structures having tapered profiles for embedded interconnect bridge substrates |
Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more |
2023-08-08 |
| 11721650 |
Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package |
Brandon C. Marin, Aleksandar Aleksov, Georgios Dogiamis, Suddhasattwa Nad, Mohammad Mamunur Rahman |
2023-08-08 |
| 11694898 |
Hybrid fine line spacing architecture for bump pitch scaling |
Suddhasattwa Nad, Bai Nie, Rahul N. Manepalli, Marcel Wall |
2023-07-04 |
| 11670504 |
Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives |
Brandon C. Marin, Andrew J. Brown, Dilan Seneviratne |
2023-06-06 |
| 11652071 |
Electronic device package including a capacitor |
Brandon C. Marin, Shivasubramanian Balasubramanian, Rahul Jain, Praneeth Akkinepally |
2023-05-16 |
| 11652036 |
Via-trace structures |
Hiroki Tanaka, Kristof Darmawikarta, Oscar Ojeda, Arnab Roy, Nicholas S. Haehn |
2023-05-16 |
| 11622448 |
Sandwich-molded cores for high-inductance architectures |
Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Andrew J. Brown, Gang Duan +1 more |
2023-04-04 |
| 11605867 |
Fabricating an RF filter on a semiconductor package using selective seeding |
Brandon C. Marin, Aleksandar Aleksov, Kristof Darmawikarta, Yonggang Li, Dilan Seneviratne |
2023-03-14 |
| 11569160 |
Patterning of dual metallization layers |
— |
2023-01-31 |