Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Je-Young Chang, Kyle Arrington, Aaron McCann, Edvin Cetegen +4 more | 2023-11-28 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Thomas HEATON, Steve Cho, Rahul Jain, Tarek A. Ibrahim +4 more | 2023-10-03 |
| 11652036 | Via-trace structures | Jeremy Ecton, Hiroki Tanaka, Kristof Darmawikarta, Oscar Ojeda, Arnab Roy | 2023-05-16 |
| 11640929 | Thermal management solutions for cored substrates | Nicholas Neal, Divya Mani | 2023-05-02 |
| 11594463 | Substrate thermal layer for heat spreader connection | Nicholas Neal | 2023-02-28 |