Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830783 | Embedded substrate heat sink for bottom side cooling | Aastha Uppal, Je-Young Chang | 2023-11-28 |
| 11640929 | Thermal management solutions for cored substrates | Nicholas Neal, Nicholas S. Haehn | 2023-05-02 |
| 11581240 | Liquid thermal interface material in electronic packaging | Kedar Dhane, Omkar G. Karhade, Aravindha R. Antoniswamy | 2023-02-14 |