Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830783 | Embedded substrate heat sink for bottom side cooling | Divya Mani, Je-Young Chang | 2023-11-28 |
| 11769753 | Thermally-optimized tunable stack in cavity package-on-package | George Vakanas, Shereen ELHALAWATY, Aaron McCann, Edvin Cetegen, Tannaz Harirchian +1 more | 2023-09-26 |
| 11735495 | Active package cooling structures using molded substrate packaging technology | Omkar G. Karhade, Mitul Modi, Edvin Cetegen | 2023-08-22 |
| 11721607 | Integrated circuit assemblies having metal foam structures | Je-Young Chang | 2023-08-08 |
| 11676883 | Thermoelectric coolers combined with phase-change material in integrated circuit packages | Javed Shaikh, Je-Young Chang, Kelly Lofgreen, Weihua Tang | 2023-06-13 |
| 11664294 | Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies | Je-Young Chang, Weihua Tang, Minseok Ha | 2023-05-30 |
| 11574851 | Coupled cooling fins in ultra-small systems | Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang, Nitin A. Deshpande +6 more | 2023-02-07 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more | 2023-01-03 |