Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854935 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Nicholas Neal, Zhimin Wan | 2023-12-26 |
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Edvin Cetegen +4 more | 2023-11-28 |
| 11769753 | Thermally-optimized tunable stack in cavity package-on-package | George Vakanas, Aastha Uppal, Shereen ELHALAWATY, Edvin Cetegen, Tannaz Harirchian +1 more | 2023-09-26 |
| 11679407 | Liquid metal thermal interface material application | Kyle Arrington, Joseph Petrini, Shankar Devasenathipathy, James C. Matayabas, Jr., Mostafa Aghazadeh +1 more | 2023-06-20 |