Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854931 | STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die | Zhimin Wan, Chia-Pin Chiu, Peng Li | 2023-12-26 |
| 11854935 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Aaron McCann, Nicholas Neal, Zhimin Wan | 2023-12-26 |
| 11679407 | Liquid metal thermal interface material application | Kyle Arrington, Joseph Petrini, Aaron McCann, James C. Matayabas, Jr., Mostafa Aghazadeh +1 more | 2023-06-20 |
| 11646244 | Socket loading mechanism for passive or active socket and package cooling | Steven A. Klein, Zhimin Wan, Chia-Pin Chiu | 2023-05-09 |
| 11581671 | Integrated circuit package socket housing to enhance package cooling | Zhimin Wan, Steven A. Klein, Chia-Pin Chiu | 2023-02-14 |