| 11854931 |
STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die |
Zhimin Wan, Peng Li, Shankar Devasenathipathy |
2023-12-26 |
| 11837519 |
Heatsink cutout and insulating through silicon vias to cut thermal cross-talk |
Zhimin Wan, Chandra Mohan Jha |
2023-12-05 |
| 11824008 |
Multi-chip package and method of providing die-to-die interconnects in same |
Henning Braunisch, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more |
2023-11-21 |
| 11810884 |
High density substrate routing in package |
Weng Hong Teh |
2023-11-07 |
| 11670561 |
3D buildup of thermally conductive layers to resolve die height differences |
Zhimin Wan, Chandra Mohan Jha, Je-Young Chang, Liwei Wang |
2023-06-06 |
| 11652020 |
Thermal solutions for multi-package assemblies and methods for fabricating the same |
Robert L. Sankman |
2023-05-16 |
| 11646244 |
Socket loading mechanism for passive or active socket and package cooling |
Steven A. Klein, Zhimin Wan, Shankar Devasenathipathy |
2023-05-09 |
| 11581671 |
Integrated circuit package socket housing to enhance package cooling |
Zhimin Wan, Steven A. Klein, Shankar Devasenathipathy |
2023-02-14 |
| 11579426 |
Dual collimating lens configuration for optical devices |
Anna M. Prakash |
2023-02-14 |
| 11551994 |
Liquid metal TIM with STIM-like performance with no BSM and BGA compatible |
Kelly Lofgreen, Joseph Petrini, Edvin Cetegen, Betsegaw K. Gebrehiwot, Feras Eid |
2023-01-10 |