Issued Patents 2023
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854931 | STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die | Zhimin Wan, Chia-Pin Chiu, Shankar Devasenathipathy | 2023-12-26 |
| 11828855 | Sensor support systems and methods | Nan Wu | 2023-11-28 |
| 11817369 | Lids for integrated circuit packages with solder thermal interface materials | Bamidele Daniel Falola, Susmriti Das Mahapatra, Sergio Antonio Chan Arguedas, Amitesh Saha | 2023-11-14 |
| 11808915 | Wind power prediction method and system based on deep deterministic policy gradient algorithm | Ming-Hsuan Yang, Menglin Li, Yixiao Yu | 2023-11-07 |
| 11798861 | Integrated heat spreader (IHS) with heating element | Kelly Lofgreen, Manish Dubey, Bamidele Daniel Falola, Ken Hackenberg, Shenavia S. Howell +3 more | 2023-10-24 |
| 11799988 | User datagram protocol segmentation offload for virtual machines | Ronak Doshi, Guolin Yang, Boon Seong Ang | 2023-10-24 |
| D1001510 | Brush head | Bin Chen, Liang Peng | 2023-10-17 |
| 11791237 | Microelectronic assemblies including a thermal interface material | Sergio Antonio Chan Arguedas, Yongmei Liu, Deepak Goyal, Ken Hackenberg | 2023-10-17 |
| 11784734 | Method and apparatus for multi-path delay estimation | Wei Zhou, Luanxia YANG | 2023-10-10 |
| 11785535 | Method and apparatus for service discovery | Cheng Wang, Xinyu Zhang | 2023-10-10 |
| 11681463 | Offload defrag operation for host-managed storage | Jawad B. Khan, Sanjeev N. Trika | 2023-06-20 |
| 11682605 | Integrated circuit packages with asymmetric adhesion material regions | Karthik Visvanathan, Shenavia S. Howell, Sergio Antonio Chan Arguedas | 2023-06-20 |
| 11676873 | Semiconductor package having sealant bridge | Dinesh Padmanabhan Ramalekshmi Thanu, Hemanth K. Dhavaleswarapu, Venkata Suresh R. Guthikonda, John J. Beatty, Yonghao An +2 more | 2023-06-13 |
| 11674381 | Prediction method for coal and gas outburst based on comparing borehole gas flow curves | Rui Zhou, Kaijia Zhang, Haisheng Qiu, Hongzhen Zhang, Xing Ni +3 more | 2023-06-13 |
| 11670569 | Channeled lids for integrated circuit packages | Manish Dubey, Amitesh Saha, Marco Aurelio Cartas, Bamidele Daniel Falola | 2023-06-06 |
| 11650875 | Abnormal inode dynamic repair method and system, and related component | Xiangrui Meng | 2023-05-16 |
| 11588962 | Flexible screen module, terminal device and photographing method | Xuwang Cui | 2023-02-21 |
| 11579986 | Data query method and apparatus | — | 2023-02-14 |
| 11573895 | Storage system with interconnected solid state disks | Jawad B. Khan, Sanjeev N. Trika | 2023-02-07 |