Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854935 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal | 2023-12-26 |
| 11854931 | STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die | Chia-Pin Chiu, Peng Li, Shankar Devasenathipathy | 2023-12-26 |
| 11837519 | Heatsink cutout and insulating through silicon vias to cut thermal cross-talk | Chia-Pin Chiu, Chandra Mohan Jha | 2023-12-05 |
| 11670561 | 3D buildup of thermally conductive layers to resolve die height differences | Chandra Mohan Jha, Je-Young Chang, Chia-Pin Chiu, Liwei Wang | 2023-06-06 |
| 11646244 | Socket loading mechanism for passive or active socket and package cooling | Steven A. Klein, Chia-Pin Chiu, Shankar Devasenathipathy | 2023-05-09 |
| 11626395 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Pooya Tadayon, Weihua Tang, Chandra Mohan Jha | 2023-04-11 |
| 11581671 | Integrated circuit package socket housing to enhance package cooling | Steven A. Klein, Chia-Pin Chiu, Shankar Devasenathipathy | 2023-02-14 |