Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854935 | Enhanced base die heat path using through-silicon vias | Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2023-12-26 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854935 | Enhanced base die heat path using through-silicon vias | Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal, Zhimin Wan | 2023-12-26 |