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Enhanced base die heat path using through-silicon vias |
Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Zhimin Wan |
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| 11832419 |
Full package vapor chamber with IHS |
Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann, Edvin Cetegen +4 more |
2023-11-28 |
| 11804418 |
Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions |
Je-Young Chang, Jae Whan Kim, Ravindranath V. Mahajan |
2023-10-31 |
| 11776864 |
Corner guard for improved electroplated first level interconnect bump height range |
Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more |
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| 11640929 |
Thermal management solutions for cored substrates |
Divya Mani, Nicholas S. Haehn |
2023-05-02 |
| 11594463 |
Substrate thermal layer for heat spreader connection |
Nicholas S. Haehn |
2023-02-28 |
| 11587843 |
Thermal bump networks for integrated circuit device assemblies |
Prasad Ramanathan, Chandra Mohan Jha |
2023-02-21 |