Issued Patents 2023
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more | 2023-11-28 |
| 11830863 | Dual-sided co-packaged optics for high bandwidth networking applications | Suresh Pothukuchi, Andrew C. Alduino, Srikant Nekkanty, Ling Liao, Harinadh POTLURI +5 more | 2023-11-28 |
| 11824018 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2023-11-21 |
| 11804418 | Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions | Nicholas Neal, Je-Young Chang, Jae Whan Kim | 2023-10-31 |
| 11798865 | Nested architectures for enhanced heterogeneous integration | Debendra Mallik, Sujit Sharan, Digvijay A. Raorane | 2023-10-24 |
| 11756856 | Package architecture including thermoelectric cooler structures | Krishna Vasanth Valavala, Chandra Mohan Jha, Kelly Lofgreen, Weihua Tang | 2023-09-12 |
| 11756889 | Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Robert L. Sankman | 2023-09-12 |
| 11749577 | IC package including multi-chip unit with bonded integrated heat spreader | Debendra Mallik, Digvijay A. Raorane | 2023-09-05 |
| 11742261 | Nested architectures for enhanced heterogeneous integration | Debendra Mallik, Sujit Sharan, Digvijay A. Raorane | 2023-08-29 |
| 11742293 | Multiple die package using an embedded bridge connecting dies | Yidnekachew S. Mekonnen, Kemel Aygun, Christopher S. Baldwin, Rajasekaran Swaminathan | 2023-08-29 |
| 11735533 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha | 2023-08-22 |
| 11705377 | Stacked die cavity package | Mitul Modi, Robert L. Sankman, Debendra Mallik, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2023-07-18 |
| 11694959 | Multi-die ultrafine pitch patch architecture and method of making | Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Debendra Mallik, Robert L. Sankman | 2023-07-04 |
| 11664293 | Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios | Krishna Vasanth Valavala, Chandra Mohan Jha | 2023-05-30 |
| 11595045 | Programmable logic device with fine-grained disaggregation | Dheeraj Subbareddy, MD Altaf Hossain, Ankireddy Nalamalpu, Robert Sankman, Gregg William Baeckler | 2023-02-28 |
| 11587851 | Embedded bridge with through-silicon vias | Aditya S. Vaidya, Digvijay A. Raorane, Paul R. Start | 2023-02-21 |
| 11581235 | IC package including multi-chip unit with bonded integrated heat spreader | Debendra Mallik, Digvijay A. Raorane | 2023-02-14 |
| 11569173 | Bridge hub tiling architecture | Andrew Collins, Digvijay A. Raorane, Wilfred Gomes, Sujit Sharan | 2023-01-31 |
| 11557541 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Debendra Mallik +7 more | 2023-01-17 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more | 2023-01-03 |