Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742293 | Multiple die package using an embedded bridge connecting dies | Yidnekachew S. Mekonnen, Kemel Aygun, Ravindranath V. Mahajan, Rajasekaran Swaminathan | 2023-08-29 |
| 11577337 | Acoustically enhanced optical cables | Andre R. Vincelette, Paul Lefebvre, Hongbo Li, Domino Taverner, James Dunphy | 2023-02-14 |