Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742293 | Multiple die package using an embedded bridge connecting dies | Yidnekachew S. Mekonnen, Ravindranath V. Mahajan, Christopher S. Baldwin, Rajasekaran Swaminathan | 2023-08-29 |