Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817364 | BGA STIM package architecture for high performance systems | Mukul Renavikar | 2023-11-14 |
| 11742293 | Multiple die package using an embedded bridge connecting dies | Yidnekachew S. Mekonnen, Kemel Aygun, Ravindranath V. Mahajan, Christopher S. Baldwin | 2023-08-29 |
| 11705398 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Bharat P. Penmecha, Ram Viswanath | 2023-07-18 |