Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824018 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram | 2023-11-21 |
| 11735533 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram | 2023-08-22 |
| 11705398 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Andrew Collins, Rajasekaran Swaminathan, Ram Viswanath | 2023-07-18 |