| 11824018 |
Heterogeneous nested interposer package for IC chips |
Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha |
2023-11-21 |
|
| 11804441 |
Microelectronic structures including bridges |
Omkar G. Karhade, Nitin A. Deshpande, Mohit Bhatia |
2023-10-31 |
$30,374,000 |
| 11798865 |
Nested architectures for enhanced heterogeneous integration |
Ravindranath V. Mahajan, Sujit Sharan, Digvijay A. Raorane |
2023-10-24 |
$20,059,000 |
| 11798887 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Robert L. Sankman |
2023-10-24 |
$20,059,000 |
| 11764080 |
Low cost package warpage solution |
Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita |
2023-09-19 |
$20,015,000 |
| 11756889 |
Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making |
Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Ravindranath V. Mahajan, Robert L. Sankman |
2023-09-12 |
$19,004,000 |
| 11749577 |
IC package including multi-chip unit with bonded integrated heat spreader |
Ravindranath V. Mahajan, Digvijay A. Raorane |
2023-09-05 |
$19,899,000 |
| 11742261 |
Nested architectures for enhanced heterogeneous integration |
Ravindranath V. Mahajan, Sujit Sharan, Digvijay A. Raorane |
2023-08-29 |
$19,273,000 |
| 11735552 |
Microelectronic package with solder array thermal interface material (SA-TIM) |
Sergio Antonio Chan Arguedas, Jimin Yao, Chandra Mohan Jha |
2023-08-22 |
$16,803,000 |
| 11735533 |
Heterogeneous nested interposer package for IC chips |
Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Srinivas V. Pietambaram, Bharat P. Penmecha |
2023-08-22 |
$16,803,000 |
| 11705377 |
Stacked die cavity package |
Mitul Modi, Robert L. Sankman, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more |
2023-07-18 |
$21,060,000 |
| 11694959 |
Multi-die ultrafine pitch patch architecture and method of making |
Sanka Ganesan, Kevin Thomas McCarthy, Leigh M. TRIBOLET, Ravindranath V. Mahajan, Robert L. Sankman |
2023-07-04 |
|
| 11658111 |
Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge |
Jiun Hann Sir, Poh Boon Khoo, Eng Huat Goh, Amruthavalli Pallavi Alur |
2023-05-23 |
$11,397,000 |
| 11581235 |
IC package including multi-chip unit with bonded integrated heat spreader |
Ravindranath V. Mahajan, Digvijay A. Raorane |
2023-02-14 |
$12,790,000 |
| 11557541 |
Interconnect architecture with silicon interposer and EMIB |
MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more |
2023-01-17 |
$13,997,000 |
| 11552035 |
Electronic package with stud bump electrical connections |
Zhaozhi Li, Sanka Ganesan, Gregory Perry, Kuan-Hsun Lu, Omkar G. Karhade +1 more |
2023-01-10 |
$14,061,000 |
| 11545441 |
Semiconductor package having wafer-level active die and external die mount |
Vipul V. Mehta, Eric J. Li, Sanka Ganesan, Robert L. Sankman |
2023-01-03 |
$15,575,000 |
| 11545407 |
Thermal management solutions for integrated circuit packages |
Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more |
2023-01-03 |
$15,575,000 |
